• Home
  • About
    • Company
    • ORVEM Group
    • ISO 9001
  • Services
  • Products
    • Cabling systems
      • LVDS
      • Crimp
      • Soldering
      • IDC
      • Overmolding
      • Coax / RF
    • Embedded assemblies
    • Telecom rack (TLC)
  • Quality
  • News
  • Contacts
  • Home
  • About
    • Company
    • ORVEM Group
    • ISO 9001
  • Services
  • Products
    • Cabling systems
      • LVDS
      • Crimp
      • Soldering
      • IDC
      • Overmolding
      • Coax / RF
    • Embedded assemblies
    • Telecom rack (TLC)
  • Quality
  • News
  • Contacts
Language
  • Italiano
  • English

Month: May 2017

AMPMODU Mod IV and Mod V

Posted on 23 May 2017 (23 April 2021) by Luca Cortazzo

We enlange the capability of AMPMODU family. In addition to Mod I and Mod II we are now able to crimp AMPMODU Mod IV and Mod V. Rugged and reliable wire to board connectors for automotive, medical instruments and other demanding applications Wire to board system Polarization Strain relief AWG 24-26 : 2-87195-4 AWG 28-32 […]

Read More… from AMPMODU Mod IV and Mod V

Leave a comment on AMPMODU Mod IV and Mod V

Recent Posts

  • Molex – CLIK Mate Wire-to-Board Connectors – New Tooling
  • Hirose DF57
  • HIROSE – DF63W – New Tooling
  • HIROSE DF19
  • HIROSE – DF62- New Tooling

Recent Comments

    Archives

    • April 2021
    • March 2021
    • January 2021
    • February 2020
    • September 2019
    • September 2017
    • June 2017
    • May 2017
    • January 2017
    • September 2016

    Categories

    • Senza categoria

    Meta

    • Log in
    • Entries feed
    • Comments feed
    • WordPress.org

    Registered office

    Sacco e Vanzetti 34
    20099 | Sesto san Giovanni | MI
    Italy


    Contacts

    Via Teresa Noce, 3
    20060 | Pessano con Bornago | MI
    Italy


    Phone: (+39) 02.9504175
    Email: info@csorvem.com

    CS ORVEM s.r.l. • VAT number: 11493840158 • © Copyright 2016 – 2023 • Cookie policy • Privacy policy • Powered by stileinverso®